US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 30 for "Semiconductor device fabrication methods and devices for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,685, issued on Dec. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device fabrication methods and devices for forming the same" was invented by Te-Chien Hou (Hsinchu, Taiwan), Chih Hung Chen (Hsinchu, Taiwan), Chi-hsiang Shen (Hsinchu, Taiwan), Yu-Heng Cheng (Hsinchu, Taiwan) and Shich-Chang Suen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chemical mechanical polishing device is provided according to some embodiments. The chemical mechanical polishing device comprises a polishing pad. The polishing pad includes a plurality of stacks of first pad fractions and a plurality of...