US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Package structure, semiconductor device and manufacturing method thereof" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,445, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure, semiconductor device and manufacturing method thereof" was invented by Fong-yuan Chang (Hsinchu County, Taiwan), Lee-Chung Lu (Taipei, Taiwan), Jyh Chwen Frank Lee (Palo Alto, Calif.), Po-Hsiang Huang (Tainan, Taiwan), Xinyu Bao (Fremont, Calif.) and Sam Vaziri (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a solder feature, a first redistribution layer structure on the solder feature, and a die mounted on and electrically coupled to the first redistribution layer structure. The fir...