US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Package, package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,424, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package, package structure and method of manufacturing the same" was invented by Chuei-Tang Wang (Taichung, Taiwan), Chung-Hao Tsai (Changhua County, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan), Chun-Lin Lu (Hsinchu, Taiwan), Han-Ping Pu (Taichung, Taiwan) and Kai-Chiang Wu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a semiconductor package including a semiconductor die and a first insulating encapsulation, a substrate, and a second insulating encapsulation. The first insulating encapsulation encapsulates the semi...