US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Integrated chip having a buried power rail" (Belgian Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,410, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated chip having a buried power rail" was invented by Marcus Johannes Henricus Van Dal (Linden, Belgium) and Gerben Doornbos (Kessel-Lo, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an integrated chip including a channel structure on a first substrate. A gate electrode overlies the channel structure. A first source/drain structure abuts the channel structure and is offset from the gate electrode. A conductive structure is disposed on the first substrate and underlies the first source/drain structur...