US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Dummy through vias for integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,331, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Dummy through vias for integrated circuit packages and methods of forming the same" was invented by Chien-Li Kuo (Hsinchu, Taiwan), Chien-Chen Li (Hsinchu, Taiwan), Kuo-Chio Liu (Hsinchu, Taiwan), Kuang-Chun Lee (New Taipei, Taiwan) and Wen-Yi Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: an integrated circuit die including a die connector; a first through via adjacent the integrated circuit die; an encapsulant encapsulating the first through via and the integrated circuit die; and a re...