US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 30 for "Dicing process in packages comprising organic interposers" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,432, issued on Dec. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Dicing process in packages comprising organic interposers" was invented by Chipta Priya Laksana (Taoyuan, Taiwan), Chun-Lung Jao (Shuili Township, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Chien-Sheng Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming an interconnect component including a plurality of dielectric layers that include an organic dielectric material, and a plurality of redistribution lines extending into the plurality of dielectric layers. The method furthe...