US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 23 for "Semiconductor package with redistribution structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,087, issued on Dec. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package with redistribution structure and manufacturing method thereof" was invented by Wei-Cheng Wu (Hsinchu, Taiwan), Chien-Chia Chiu (Taoyuan, Taiwan), Cheng-Hsien Hsieh (Kaohsiung, Taiwan), Li-Han Hsu (Hsin-Chu, Taiwan), Meng-Tsan Lee (Hsinchu, Taiwan) and Tsung-Shu Lin (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first met...