US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 23 for "Semiconductor package including stress buffers and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,090, issued on Dec. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including stress buffers and methods of forming the same" was invented by Po-Chen Lai (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Chin-Hua Wang (New Taipei, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate; a semiconductor die vertically stacked on the package substrate; a redistribution layer (RDL) including a dielectric material and metal features that electrically connect the semiconductor die to the package substr...