US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 23 for "Semiconductor device and manufacturing method" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,426, issued on Dec. 23, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method" was invented by Chia-Ming Hung (Hsinchu, Taiwan), I-Hsuan Chiu (Hsinchu, Taiwan), Hsiang-Fu Chen (Hsinchu, Taiwan), Kang-Yi Lien (Hsinchu, Taiwan) and Chu-Heng Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first substrate having opposite first and second sides, a first conductive layer on the first side of the first substrate, and a second substrate having opposite first and second sides. The second side of the second substrate is bonded to ...