ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,008, issued on Dec. 23, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure" was invented by Feng-Cheng Hsu (New Taipei, Taiwan), Shuo-Mao Chen (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a package structure including a die, a through via, an encapsulant, a warpage controlling layer, and a cap. The through via is laterally aside the die. The encapsulant laterally encapsulates the through via and the die. The warpage controlling layer covers the encapsulant and the die. The cap is laterally aside the warpage controlling layer and on th...