ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,001, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).
"Wet etch apparatus" was invented by Hong-Ting Lu (Taichung, Taiwan) and Han-Wen Liao (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wet etch apparatus includes a wafer chuck, a dispensing nozzle above the wafer chuck, a rail, first and second vehicles, and an electric field generator. The rail extends at least from a first position aligned laterally with the wafer chuck to a second position higher than a top surface of the wafer chuck. The first and second vehicles are movable along the rail. The electric field generator is opera...