ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,487, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Tunable structure profile" was invented by Li-Wei Yin (Hsinchu, Taiwan), Tzu-Wen Pan (Hsinchu, Taiwan), Yu-Hsien Lin (Kaohsiung, Taiwan), Jih-Sheng Yang (Hsinchu, Taiwan), Shih-Chieh Chao (Taichung, Taiwan), Chia Ming Liang (Taipei, Taiwan), Yih-Ann Lin (Hsinchu, Taiwan) and Ryan Chia-Jen Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are structures and methods for forming structures with sloping surfaces of a desired profile. An exemplary method includes performing a first etch process to differentially etch a gat...