US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Stacked structure for CMOS image sensors" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,538, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stacked structure for CMOS image sensors" was invented by Min-Feng Kao (Chiayi, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Jen-Cheng Liu (Hsin-Chu, Taiwan), Wen-Chang Kuo (Tainan, Taiwan), Sheng-Chau Chen (Tainan, Taiwan), Feng-Chi Hung (Chu-Bei, Taiwan) and Sheng-Chan Li (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments relate to an image sensor. The image sensor includes a semiconductor substrate including a pixel region and a peripheral region. A backside isolation structure extends into a backside of the semiconducto...