US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Semiconductor processing tool and methods of operation" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,968, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor processing tool and methods of operation" was invented by Liang Yu Chen (Hsinchu, Taiwan), Yu-Chi Lin (Hsinchu, Taiwan), Yu Hsi Tang (Hsinchu, Taiwan) and Chih-Teng Liao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein provide techniques and apparatuses for improving a uniformity of a flow of a gas across a semiconductor substrate in an etch tool. The etch tool includes an exhaust port located at a bottom center of a chamber of the etch tool. The etch tool further includes a flow-con...