US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 2 for "Package structure with through vias" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,045, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with through vias" was invented by Ling-Wei Li (Hsinchu, Taiwan), Jung-Hua Chang (Hsinchu, Taiwan) and Cheng-Lin Huang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a conductive structure having a first portion with a first sidewall and a second portion with a second sidewall, and the first sidewall and the second sidewall have different slopes. The package structure also includes a semiconductor chip beside the conductive structure and a protecti...