US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 2 for "Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,030, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure" was invented by Hao-Jan Pei (Hsinchu, Taiwan), Wei-Yu Chen (Taipei, Taiwan), Chia-Shen Cheng (Hsinchu, Taiwan), Chih-Chiang Tsao (Taoyuan, Taiwan), Cheng-Ting Chen (Taichung, Taiwan), Chia-Lun Chang (Tainan, Taiwan), Chih-Wei Lin (Zhubei, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a die embedded in a moldin...