US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,064, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for forming mark, packaging method of semiconductor device, and semiconductor device having the mark" was invented by Shih-Wei Chen (Hsinchu, Taiwan), Po-Yuan Teng (Hsinchu, Taiwan), Chiahung Liu (Hsinchu, Taiwan) and Hao-Yi Tsai (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a method for forming a mark, a packaging method for a semiconductor device, and a semiconductor device having the mark, wherein the marking material is a polymer compound and the light transmittance of the marking materi...