US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Lamination apparatus and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,664, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Lamination apparatus and method" was invented by Yu-Ting Chiu (Hsinchu County, Taiwan), Ying-Jui Huang (Hsinchu County, Taiwan), Chien-Ling Hwang (Hsinchu, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for laminating a film to a wafer and apparatus for performing the lamination process are disclosed. The method includes providing the wafer and the film in a process chamber where the wafer and the film are separated from each other, achieving a vacuum state and a process temperature in the proces...