US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,016, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit packages and methods of forming the same" was invented by Ming-Tsu Chung (Hsinchu, Taiwan), Yung-Chi Lin (Su-Lin, Taiwan) and Yi-Hsiu Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes bonding an integrated circuit die to a carrier substrate, forming a gap-filling dielectric around the integrated circuit die and along the edge of the carrier substrate, performing a bevel clean process to remove portions of the gap-filling dielectric from the edge of the carrier substrate, after performing the be...