ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,488,965, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Device and method for treating substrate" was invented by Zi-Wei Zhu (Hsinchu, Taiwan) and Shao-Yong Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a substrate retainer for retaining a substrate thereon, and a ring assembly including an upper ring which has a plurality of upper ring segments that are angularly displaced from each other. Each of the upper ring segments is movable between an inner position and an outer position so as to adjust a gap between an outer periphery of the substrate and an inner ed...