US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 2 for "Chip package structure with conductive shielding film" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,089, issued on Dec. 2, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip package structure with conductive shielding film" was invented by Chen-Hua Yu (Hsinchu, Taiwan), An-Jhih Su (Taoyuan, Taiwan), Jing-Cheng Lin (Hsinchu, Taiwan) and Po-Hao Tsai (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground...