US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 2 for "Apparatus and method for use with a substrate chamber" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,597, issued on Dec. 2, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Apparatus and method for use with a substrate chamber" was invented by Li-Ting Wang (Hsinchu, Taiwan), Jung-Jen Chen (Hsinchu, Taiwan), Ming-Hua Yu (Hsinchu, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, an apparatus includes a first pyrometer and a second pyrometer configured to monitor thermal radiation from a first point and a second point on a backside of a wafer, respectively, a first heating source in a first region and a second heating source in a second region of an epitaxial growt...