US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,113, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package" was invented by Yu-Ching Lo (Hsinchu, Taiwan), Ching-Pin Yuan (Hsinchu, Taiwan), Wei-Jie Huang (New Taipei, Taiwan), Cheng-Yu Kuo (Kaohsiung, Taiwan), Yi-Yang Lei (Taichung, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A workpiece chuck includes a supporting platform, a vacuum system, and a gas permeable buffer layer. The supporting platform has a supporting surface for holding a workpiece thereon. The vacuum...