US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Trimming and sawing processes in the formation of wafer-form packages" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,219, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Trimming and sawing processes in the formation of wafer-form packages" was invented by Mao-Yen Chang (Kaohsiung, Taiwan), Yu-Chia Lai (Zhunan Township, Taiwan), Kuo-Lung Pan (Hsinchu, Taiwan), Cheng-Shiuan Wong (Hsinchu, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a reconstructed wafer, which includes placing a plurality of device dies over a carrier, encapsulating the plurality of device dies in an encapsulant, and forming a redistribution str...