US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Stopper bump structures for MEMS device" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,285, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stopper bump structures for MEMS device" was invented by Wei-Jhih Mao (Taipei, Taiwan), Shang-Ying Tsai (Pingzhen, Taiwan), Kuei-Sung Chang (Kaohsiung, Taiwan) and Chun-Wen Cheng (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable ele...