US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Semiconductor processing tool and methods of operation" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,106, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor processing tool and methods of operation" was invented by Hsuan-Ying Peng (Hsinchu, Taiwan), Chin-Szu Lee (Taoyuan, Taiwan), Chiang Hsien Shih (Hsinchu, Taiwan), Chih-Chang Wu (Hsinchu, Taiwan) and Che-Wei Tung (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein provide a deposition tool that includes a grounding component between an edge ring of a substrate stage and a pumping plate component. The grounding component includes a grounding strap having a deformation region. The deforma...