US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Semiconductor device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,149, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of forming the same" was invented by Yung-Sheng Lin (Hsinchu County, Taiwan), Cheng-Lung Yang (Kaohsiung, Taiwan), Chin-Yu Ku (Hsinchu, Taiwan), Ming-Da Cheng (Taoyuan, Taiwan), Wen-Hsiung Lu (Tainan, Taiwan), Tang-Wei Huang (Hsinchu, Taiwan) and Fu Wei Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device and a method of forming the same are provided. The semiconductor device includes at least one substrate and an interconnection structure. The at least one substrate has a cavit...