ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,166, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Wei-Kai Shih (Nantou County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "One of the semiconductor devices includes a semiconductor substrate, a passivation layer and a conductive pattern. The semiconductor substrate includes a conductive pad thereover. The passivation layer over the semiconductor substrate. The conductive pattern is penetrating through the passivation layer and electrically connected to the conductive pad, wherein a sidewall of the conductive pattern interfacing with the passivation ...