US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 16 for "Revising IC layout design to eliminate gaps between isolation structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,713, issued on Dec. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Revising IC layout design to eliminate gaps between isolation structures" was invented by Tun Jen Chang (Hsinchu, Taiwan), Tung-Heng Hsieh (Hsinchu County, Taiwan) and Bao-Ru Young (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) layout design is received that includes a first circuit cell and a second circuit cell abutted to one another. The first circuit cell contains a first IC component, and the second circuit cell contains a second IC component. A determination is made that a distance betwe...