US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Power rails for stacked semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,701, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Power rails for stacked semiconductor device" was invented by Chansyun David Yang (Shinchu, Taiwan), Keh-Jeng Chang (Hsinchu, Taiwan) and Chan-Lon Yang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure describes a method to form a stacked semiconductor device with power rails. The method includes forming the stacked semiconductor device on a first surface of a substrate. The stacked semiconductor device includes a first fin structure, an isolation structure on the first fin structure, and a second fin structure ...