US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Package with heat dissipation structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,139, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package with heat dissipation structure and method for forming the same" was invented by Tung-Liang Shao (Hsinchu, Taiwan), You-Rong Shaw (Hsinchu, Taiwan), Yu-Sheng Huang (Hemei Township, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a package includes an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; a sealant disposed ove...