US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Package structure with conductive patterns in a redistribution layer" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,200, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure with conductive patterns in a redistribution layer" was invented by Yu-Chia Lai (Miaoli County, Taiwan), Chih-Horng Chang (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Chih-Hsuan Tai (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes an insulating encapsulation, a semiconductor die, and a redistribution circuit structure. The semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure includes conductive patterns, wherein the conductive pat...