US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Package assembly including a package lid having a step region and method of making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,134, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package assembly including a package lid having a step region and method of making the same" was invented by Ping-Yin Hsieh (Hsinchu, Taiwan), Yu-Hsun Wang (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package assembly includes an interposer module on a package substrate, a thermal interface material (TIM) film on the interposer module, and a package lid that includes a plate portion on the TIM film and a step region projecting away from the plate portion and l...