US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,192, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package and manufacturing method thereof" was invented by Ming-Fa Chen (Taichung, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan) and Sung-Feng Yeh (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first die, a second die, an encapsulant, and through insulating vias (TIV). The first die has a first bonding structure. The first bonding structure includes a first dielectric layer and first connectors embedded in the first dielectric layer. The second die has a semiconductor substrate and a second bonding structure over th...