US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 16 for "Multi-wafer stacked CMOS image sensor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,190, issued on Dec. 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Multi-wafer stacked CMOS image sensor structure" was invented by Ming-Hsien Yang (Taichung, Taiwan), Chia-Yu Wei (Tainan, Taiwan), Chun-Hao Chou (Tainan, Taiwan), Kuo-Cheng Lee (Tainan, Taiwan), Chung-Liang Cheng (Changhua County, Taiwan) and Sheng-Chau Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked CMOS image sensor (CIS) structure is provided. The stacked CIS structure comprises a first die, a second die and a third die. The first die comprises a photodiode, a transfer gate, a selective conversion gain (SCG) sw...