US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Method of singulating a semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,124, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of singulating a semiconductor device" was invented by Yi-Chao Mao (Zhongli, Taiwan), Tsung-Fu Tsai (Changhua, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments provide a precutting technique to cut parallel openings at a front surface of a device wafer, then flipping the device wafer over and completing the cut from the back side of the device wafer to singulate a die from the wafer. The precutting technique and back side cutting technique combined provides an ...