US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Method of fabricating semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,127, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating semiconductor structure" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Ying-Ju Chen (Yunlin County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes the following steps. A semiconductor wafer including integrated circuit components, seal rings respectively encircling the integrated circuit components and testing structures disposed between the seal rings is provided. A first wafer saw process is performed at least along a first path to singulate the semiconductor ...