US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Mechanical wafer alignment detection for bonding process" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,206, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Mechanical wafer alignment detection for bonding process" was invented by Ching-Hung Wang (Hsinchu, Taiwan), Yeong-Jyh Lin (Caotun Township, Taiwan), Ching I Li (Tainan, Taiwan), Tzu-Wei Yu (Hsinchu, Taiwan) and Chung-Yi Yu (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure. The method includes performing a bonding process to bond a first semiconductor substrate to a second semiconductor substrate. A shift measurement pro...