US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Integrated fan-out package having stress release structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,208, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated fan-out package having stress release structure" was invented by Ming-Chih Yew (Hsinchu, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first die, a second die and a buffer layer. The first die and the second die are stacked on the first die. The buffer layer is disposed on a first sidewall of the second die, wherein a second sidewall opposite to the firs...