ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,108, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Bonding system and method" was invented by Chien-Ling Hwang (Hsinchu, Taiwan), Chung-Jung Wu (Hsinchu, Taiwan), Tung Li Wu (Hsinchu, Taiwan), Wei-Chih Chen (Hsinchu County, Taiwan), Hsu-Chin Tseng (Taoyuan, Taiwan) and Jeng-Nan Hung (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a bonding system and a bonding method. In one embodiment, the bonding system includes a chamber, first and second electrostatic chucks, a visible light sensor module and a nonvisible light module. The chamber is configured to provide a vacuu...