US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Stacked substrate structure with inter-tier interconnection" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,744, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Stacked substrate structure with inter-tier interconnection" was invented by Jeng-Shyan Lin (Tainan, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Jen-Cheng Liu (Hsin-Chu, Taiwan), Hsun-Ying Huang (Tainan, Taiwan), Wei-Chih Weng (Tainan, Taiwan) and Yu-Yang Shen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method includes forming a first dielectric bonding layer over a first dielectric structure, which is disposed on a first...