US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 5 for "Semiconductor structure and manufacturing method for the semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,382,671, issued on Aug. 5, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method for the semiconductor structure" was invented by Chun-Yen Peng (Hsinchu, Taiwan), Chih-Yu Chang (New Taipei, Taiwan), Bo-Feng Young (Taipei, Taiwan), Te-Yang Lai (Hsinchu, Taiwan), Sai-Hooi Yeong (Hsinchu County, Taiwan) and Chi On Chui (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device and a method for fabricating a semiconductor device. The semiconductor device includes a substrate, a metal gate layer over the substrate, a chann...