US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,163, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Yu-Chih Huang (Hsinchu, Taiwan), Chih-Hao Chang (Hsinchu County, Taiwan), Po-Chun Lin (Hsinchu, Taiwan), Chun-Ti Lu (Hsinchu, Taiwan), Zheng-Gang Tsai (Hsinchu, Taiwan), Shih-Wei Chen (Hsinchu, Taiwan), Chia-Hung Liu (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a mol...