US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,191, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package" was invented by Bingchien Wu (Hsinchu, Taiwan), Wei-Jen Wu (New Taipei, Taiwan) and Chun-Yen Lo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first alignment pattern having a plurality of first scale patterns arranged in a first direction. The second semiconductor device is mounted over the fir...