US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Semiconductor die including stress-resistant bonding structures and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,171, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor die including stress-resistant bonding structures and methods of forming the same" was invented by Hui-Min Huang (Taoyuan, Taiwan), Wei-Hung Lin (Xinfeng Township, Taiwan), Kai Jun Zhan (Taoyuan, Taiwan), Chang-Jung Hsueh (Taipei, Taiwan), Wan-Yu Chiang (Chiayi, Taiwan) and Ming-Da Cheng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a ...