US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Semiconductor devices and methods of manufacture thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,195, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Semiconductor devices and methods of manufacture thereof" was invented by Shu-Ting Tsai (Kaohsiung, Taiwan), Dun-Nian Yaung (Taipei, Taiwan), Jen-Cheng Liu (Hsinchu, Taiwan), Szu-Ying Chen (Hsinchu, Taiwan) and U-Ting Chen (Wanluan Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a first semiconductor chip including a first substrate and a first conductive feature formed over the first substrate, and a second s...