ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,114, issued on Aug. 5, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).
"Package structure with fan-out feature" was invented by Ling-Wei Li (Hsinchu, Taiwan), Jung-Hua Chang (Hsinchu, Taiwan) and Cheng-Lin Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first semiconductor die having a first conductive pad and a second semiconductor die having a second conductive pad. The package structure also includes a conductive structure and a third semiconductor die. The third semiconductor die extends across a portions of the first semiconductor die and the second semicondu...