US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Package structure having grating coupler and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,379,556, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure having grating coupler and manufacturing method thereof" was invented by Feng-Wei Kuo (Hsinchu County, Taiwan), Chewn-Pu Jou (Hsinchu, Taiwan), Hsing-Kuo Hsia (Hsinchu County, Taiwan) and Chih-Wei Tseng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure comprises photonic dies and an interposer structure. Each photonic die includes a dielectric layer and a first grating coupler embedded in the dielectric layer. The interposer structure is disposed below the photonic dies. The interposer structure in...