US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Package structure and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,177, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and method of fabricating the same" was invented by Kung-Chen Yeh (Taichung, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan), Tsung-Fu Tsai (Changhua County, Taiwan) and Ying-Ching Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including an interposer, at least one semiconductor die and an insulating encapsulation is provided. The interposer includes a semiconductor substrate and an interconnect structure disposed on the semiconductor substrate, the interconnect structure includes interlayer dielectr...