US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 5 for "Package having embedded decoupling capacitor and method of forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,194, issued on Aug. 5, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package having embedded decoupling capacitor and method of forming the same" was invented by Wen-Shiang Liao (Miaoli County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package having a capacitor structure and a method of forming the same are provided. The package includes a first die; a second die bonded onto the first die; an isolation region disposed on the first die and laterally encapsulating the second die; at least one first through-via disposed aside the second die and penetrating through the isolation region; an electrode layer ...